aboutsummaryrefslogtreecommitdiffstats
path: root/Documentation/driver-api/thermal
Commit message (Collapse)AuthorAgeFilesLines
* Documentation: cpu-idle-cooling: fix a SEVERE docs build failureRandy Dunlap2020-01-311-0/+5
| | | | | | | | | | | | | | | | | | | | | Sphinx ('make htmldocs') stops with a SEVERE error: Sphinx parallel build error: SystemMessage: /home/rdunlap/lnx/next/linux-next-20200120/Documentation/driver-api/thermal/cpu-idle-cooling.rst:69: (SEVERE/4) Unexpected section title. ^ | so fix the .rst file so that the SEVERE build error does not happen. Also fix another minor formatting warning (unexpected unindent). Signed-off-by: Randy Dunlap <rdunlap@infradead.org> Cc: Zhang Rui <rui.zhang@intel.com> Cc: Daniel Lezcano <daniel.lezcano@linaro.org> Cc: Amit Kucheria <amit.kucheria@verdurent.com> Cc: linux-pm@vger.kernel.org Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/712c1152-56b5-307f-b3f3-ed03a30b804a@infradead.org
* thermal: exynos: Rename Samsung and Exynos to lowercaseKrzysztof Kozlowski2020-01-271-3/+3
| | | | | | | | | | | | | | | | | | | | | Fix up inconsistent usage of upper and lowercase letters in "Samsung" and "Exynos" names. "SAMSUNG" and "EXYNOS" are not abbreviations but regular trademarked names. Therefore they should be written with lowercase letters starting with capital letter. The lowercase "Exynos" name is promoted by its manufacturer Samsung Electronics Co., Ltd., in advertisement materials and on website. Although advertisement materials usually use uppercase "SAMSUNG", the lowercase version is used in all legal aspects (e.g. on Wikipedia and in privacy/legal statements on https://www.samsung.com/semiconductor/privacy-global/). Signed-off-by: Krzysztof Kozlowski <krzk@kernel.org> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/20200104152107.11407-7-krzk@kernel.org
* thermal/drivers/cpu_cooling: Rename to cpufreq_coolingDaniel Lezcano2020-01-271-1/+1
| | | | | | | | | | | As we introduced the idle injection cooling device called cpuidle_cooling, let's be consistent and rename the cpu_cooling to cpufreq_cooling as this one mitigates with OPPs changes. Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Acked-by: Viresh Kumar <viresh.kumar@linaro.org> Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org> Link: https://lore.kernel.org/r/20191219225317.17158-3-daniel.lezcano@linaro.org
* thermal/drivers/cpu_cooling: Add idle cooling device documentationDaniel Lezcano2020-01-271-0/+189
| | | | | | | | | | Provide some documentation for the idle injection cooling effect in order to let people to understand the rational of the approach for the idle injection CPU cooling device. Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Acked-by: Viresh Kumar <viresh.kumar@linaro.org> Link: https://lore.kernel.org/r/20191219225317.17158-1-daniel.lezcano@linaro.org
* thermal: Remove netlink supportAmit Kucheria2019-11-071-20/+6
| | | | | | | | | | There are no users of netlink messages for thermal inside the kernel. Remove the code and adjust the documentation. Signed-off-by: Amit Kucheria <amit.kucheria@linaro.org> Acked-by: Viresh Kumar <viresh.kumar@linaro.org> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/8ff02cf62186c7a54fff325fad40a2e9ca3affa6.1571656014.git.amit.kucheria@linaro.org
* docs: thermal: add it to the driver APIMauro Carvalho Chehab2019-07-319-0/+1816
The file contents mostly describes driver internals. Signed-off-by: Mauro Carvalho Chehab <mchehab+samsung@kernel.org> Signed-off-by: Jonathan Corbet <corbet@lwn.net>